Power Module Packaging Market: A Complete Guide for Investors and Researchers

[ishadeshpande]

The global power module packaging market size was USD 1.68 Billion in 2022 and is expected to register a rapid revenue CAGR of 9.7% during the forecast period. Rising demand for power module packaging technology in autonomous vehicle and Electric Vehicles (EV) is a major factor driving market revenue growth. Globally, EV Original Equipment Manufacturers (OEMs) are embracing Silicon Carbide (SiC) and Gallium Nitride (GaN) based power modules to elevate overall safety and performance standards of EV batteries. According to key findings of the International Energy Agency (IEA), EV sales exceeded 10 million in 2022. The share of EV in total sales tripled in last three years, from 4% in 2020 to 14% in 2022. Power module packaging is a crucial component for Hybrid-Electric Vehicles (HEV), Plug-In Hybrid-Electric Vehicles (PHEV), and Electric Vehicles (EV) traction inverters. This component is designed and engineered to perform critical task of transforming Direct Current (DC) electricity sourced from an EVs battery into Alternating Current (AC). In addition, power module packaging ensures highest electrical efficiency of EV’s by improving energy conversion, minimizing heat generation, and increasing driving range of EVs. The power module packaging technology is significantly incorporating to enhance Vehicle-to-Everything (V2X) communication capabilities across all levels (L1, L2, L3, L4, and L5) of Advanced Driver-Assistance System (ADAS). Power module packaging in ADAS automates various driving processes, including assisting in parking, maintaining lane position, and preventing collisions.
The titled Global Power Module Packaging Market is one of the most sought-after market reports involving an in-depth analysis of the global Power Module Packaging Market. The report’s authors have offered necessary details on the latest Power Module Packaging Market trends and the crucial parameters impacting both short-term and long-term market growth. Its panoramic view of the Power Module Packaging Market entails useful insights into the estimated Power Module Packaging Market size, revenue share, and sales distribution networks. Such helpful market insights are bound to help readers outline this ’s key outcomes in the near future.
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Competitive Terrain:
The global Power Module Packaging industry is highly consolidated owing to the presence of renowned companies operating across several international and local segments of the market. These players dominate the industry in terms of their strong geographical reach and a large number of production facilities. The companies are intensely competitive against one another and excel in their individual technological capabilities, as well as product development, innovation, and product pricing strategies.
The leading market contenders listed in the report are:
SEMIKRON Elektronik GmbH & Co. KG, Mitsubishi Electric Corporation, Infineon Technologies AG, Sanken Electric Co., Ltd, Vincotech GmbH, SCHOTT AG, NXP Semiconductors N.V., Dynex Semiconductor Ltd, Vicor Corporation, KYOCERA AVX Components (Salzburg) GmbH, Onsemi, STMicroelectronics N.V., ASE Technology Holding Co, Ltd., and Amkor Technology, Inc
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Additional information offered by the report:

• Along with a complete overview of the global Power Module Packaging market, the report provides detailed scrutiny of the diverse market trends observed on both regional and global levels.
  
  
• The report elaborates on the global Power Module Packaging market size and share governed by the major geographies.
  
  
• It performs a precise market growth forecast analysis, cost analysis, and a study of the micro- and macro-economic indicators.
  
  
• It further presents a detailed description of the company profiles of the key market contenders.
  

Segments Covered in this report are:

• Power Module Type Outlook (Revenue, USD Billion; 2019-2032)
  
  • Silicon Carbide (SiC) Module
    
  • Gallium Nitride (GaN) Module
    
  • Insulated-Gate Bipolar Transistor (IGBT) Module
    
  • Field-Effect Transistor (FET) Module
    
  • Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) Module
    
  • Others
    

• Technology Outlook (Revenue, USD Billion; 2019-2032)
  
  • Standard Packaging
    
  • Advanced Packaging
    
  • Pressure-Contact Modules
    
  • Others
    

• Thermal type Outlook (Revenue, USD Billion; 2019-2032)
  
  • Liquid-Cooled
    
  • Air-Cooled
    
  • Hybrid
    

Radical Highlights of the Power Module Packaging Market Report:

• Comprehensive overview of the Power Module Packaging market along with analysis of the changing dynamics of the market
  
  
• Growth Assessment of various market segments throughout the forecast period
  
  
• Regional and global analysis of the market players, including their market share and global position
  
  
• Growth strategies adopted by key market players to combat the impact of the COVID-19 pandemic on the market
  
  
• Impact of the technological developments and R&D advancements on the Power Module Packaging market
  
  
• Information about profit-making strategies and developmental strategies of major companies and manufacturers
  
  
• Insightful information for the new entrants willing to enter the market
  
  
• Details and insights about business expansion strategies, product launches, and other collaborations
  
  
• The report incorporates advanced analytical tools such as SWOT analysis, Porter’s Five Forces Analysis, feasibility analysis, and investment return analysis
  

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